Lichtsensor GD-F101N

1. Core Information

The core value of the ultra-thin photoelectric sensor lies in its ultra-compact size, high-speed, high-precision detection capability, and adaptability to confined spaces. It is specifically designed for miniaturization, embedded, and high-precision application scenarios, capable of filling blind spots where traditional sensors cannot be installed, achieving “invisible” detection.

2. Core Features and Key Parameters

Ultra-thin, compact design: only 4-5mm thick, specifically designed for installation in confined spaces, can be seamlessly installed in positions where traditional sensors cannot reach.

Detection Principle: Through-beam type (transmitter + receiver separated), ensuring stable detection and strong anti-interference capability.

Detection Capability: Capable of reliably detecting tiny opaque objects as small as φ0.1–0.5mm.

Response Speed: ≤1ms (some models ≤0.5ms), perfectly meeting the requirements of high-speed production lines.

3. Main Application Scenarios

3C Electronics Manufacturing: SMT feeder detection, PCB positioning confirmation, micro component presence/missing detection.

Precision Automation Equipment: Fixture/slide positioning verification, robot pick-up confirmation, equipment door/cover closure monitoring.